NeoPhotonics launches 64 GBaud micro-modulator for 400/600G applications
NeoPhotonics, a developer of optoelectronic solutions for high-speed communications networks, will demonstrate its new 64 GBaud, polarization-multiplexed, quadrature micro-modulator at the forthcoming OFC 2017 conference and exhibition.
The Micro-MOD is implemented in a small form factor (3.9x27x13 mm) package, which co-packages a quad-channel, differential 64 GBaud driver with an indium phosphide-based Mach-Zehnder quadrature modulator chip.
It is intended that the Micro-MOD will align with the Optical Internetworking Forum’s recently-announced project to develop an Implementation Agreement for a High Baud Rate Coherent Modulator Function (more information at www.oiforum.com).
This new modulator is designed for applications in pluggable coherent CFP2-ACO and CFP2-DCO modules as well as on transport linecards, and joins the NeoPhotonics family of 64 GBaud components, including a 64 GBaud Micro-ICR and ultra-narrow linewidth tunable lasers.
NeoPhotonics says its Micro-MOD has a bandwidth over 40 GHz and exhibits low insertion loss in a small form factor modulator. By integrating the drivers inside the modulator package directly adjacent to the low power InP modulator chip, the total power requirement is 4.5W.
The Micro-MOD is designed to be used in 400/600 Gbps coherent transceiver modules and in line card applications, which leverage its small size, high bandwidth and low power dissipation. The module can be configured with optional surface mount or flex connections, facilitating flexibility in component placement for critical size and PCB location constraints.
Tim Jenks, Chairman and CEO of NeoPhotonics, commented, “When coupled with our high bandwidth Micro-ICR and ultra-narrow linewidth tunable laser, this new micro-modulator represents a significant step in providing small form factor capability for next gen 400/600 Gbps datacenter interconnect, core metro and long haul networks.”
“This device is an excellent example of our advanced hybrid photonic integration capabilities as it depends on a close integration of driver and modulator chips made out of different high performance materials to achieve superior performance, low power, high reliability and stability,” he added.